Building the Infrastructure Behind the Digital Future

DIRECT LIQUID COOLING

Direct Liquid Cooling for AI & HPC Data Centers

NUXSEMI PTE. LTD. provides advanced direct liquid cooling solutions designed for high-density data centers, artificial intelligence and high-performance computing environments. Our cooling infrastructure supports increasingly powerful CPU and GPU platforms where conventional air-cooling architectures may face thermal, density and efficiency limitations.

 
Direct-to-chip cold plate liquid cooling for AI, HPC and high-density data center servers

Manifolds & Fluid Distribution

Cold plate liquid cooling provides direct thermal transfer from high-power CPUs, GPUs and accelerator platforms. NUXSEMI supports cooling architectures designed for modern AI, HPC and high-density server environments requiring efficient and reliable heat removal.

Cold Plate Cooling Systems

Enterprise coolant distribution unit CDU for direct liquid cooling
Liquid cooling manifolds and coolant distribution infrastructure for high-density data center racks

Coolant Distribution Units (CDUs)

Coolant Distribution Units form a critical part of liquid-cooled data center infrastructure by managing coolant circulation between computing equipment and facility-side cooling systems. Solutions can be selected according to rack density, cooling architecture and project requirements.
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